BGA
Cvetl's Thin / Very Thin and Fine-pitch BGAs are cavity up, wire bonded, and overmolded on rigid substrate chip scale packages. They offer small scale and light weight as well as cost saving solution for low ball counts less than 300. It is suitable for portable and handheld products and can be one of your best buy. TFBGA / VFBGA with a matrix format substrate and a common mold chase accommodates different package sizes to offer manufacturing flexibility and thus reduce time to market effectively.
APPLICATIONS
Cvetl's TFBGA / VFBGA is suitable for systems that require a smaller package size than PBGA. Example areas include: memory, analog, Flash, ASICs, RF devices and simple PLDs - end uses where cost and space are crucial. Applications include telecomm, cellular, notebook, sub-notebook, PDAs and wireless systems.
FEATURES
• Low profile: TFBGA - 1.2 / 1.4 / 1.6 mm
VFBGA - 1.0 mm
• Rigid Substrate
• Small form factor and light weight
• Flexible package size available utilizing
sawing technology
• Eutectic 63/37 Sn/Pb solder ball,
Pb-free solder optional
• 0.5 ~ 1.0 mm ball pitches available
• Full in-house design ability
• JEDEC standard outlines
