Cvetl is now offering Flip Chip CSP package; a flip chip solution for CSP packaging. Utilizing the eutectic solder bump flip chip interconnection technology, a peripheral or array flip chip bump design provides the shortest interconnection path as a replacement for conventional wire bonding. Based on the configuration of Siliconware's Thin and Fine-pitch BGA (TFBGA), the Flip Chip CSP package provides an easy-to-use construction for customers. Utilizing the fine line/space, state-of-the-art ultra fine mechanical drilled thin core laminate substrate, Siliconware's Flip Chip CSP is offering a costeffective option for high electrical performance CSP solution. Optional exposed die design allows the minimum package thickness down to 1.0 mm for handheld/portable electronics.